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Abrasive Products - List of Manufacturers, Suppliers, Companies and Products

Abrasive Products Product List

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Printed circuit board polishing product "Spiral Cutter/Buff"

Introducing a wide range of printed circuit board polishing products for tasks such as ink removal and hole filling!

We handle the "Spiral Cutter/Buff" at our company. The "Spiral Cutter" is an elastic grinding stone developed by Kuretoishi Co., Ltd. by combining years of accumulated know-how and advanced technology. In addition, we offer a rich lineup including the "VC Wheel," a convolute type with excellent grinding power, as well as the "HSW Wheel" and "PCW Wheel." [Features (Excerpt)] <Spiral Cutter> - Various resin polishing such as filling ink resin and buildup resin can be ground without clogging. - Excellent leveling ability on the surface of the substrate allows for the removal of protrusions and unevenness. <VC Wheel> - A convolute type non-woven abrasive material with excellent grinding power. - Demonstrates excellent leveling performance in resin polishing. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other abrasives

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Grinding products

Leave it to us for all your grinding product needs.

This catalog is a comprehensive catalog featuring polishing products handled by Shimaken Maki Co., Ltd. It includes centrifugal barrel polishing machines, as well as vibrating barrel polishing machines, flow barrel polishing machines, and rotary barrel polishing machines. [Contents] ■ Centrifugal barrel polishing machines ■ Vibrating barrel polishing machines ■ Flow barrel polishing machines ■ Other equipment ■ Ceramic and plastic media / Dry media ■ Wet polishing compounds / Dry polishing compounds *For more details, please download the PDF or feel free to contact us.

  • Hand polishing and filing
  • Other abrasives
  • Processing Contract

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Polishing product for printed circuit boards "ZERO Wheel"

No scratches occur, and a uniform finish surface is obtained!

The "ZERO Wheel" is a non-woven abrasive wheel used in the polishing process of printed circuit boards. By refining the buff particles, it can reduce hole clogging defects in through-holes compared to conventional products. Additionally, in surface polishing processes such as deburring after through-hole drilling (before copper plating), it provides a stable and uniform finish without wild scratches. 【Features】 - By using ultra-fine fibers and thinning the resin coating, it achieves finer buff particles and reduces hole clogging. - The thinning of the resin coating improves the uniformity of the abrasive coating, resulting in a polished surface without inconsistencies. *For more details, please download the PDF or feel free to contact us.

  • Other abrasives

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